On-Chip Power Delivery and Management / by Inna P Vaisband, Renatas Jakushokas, Mikhail Popovich, Andrey V Mezhiba, Selçuk Köse, Eby G Friedman
By: Vaisband, Inna P.
Contributor(s): SpringerLink (Online service)
| Jakushokas, Renatas
| Popovich, Mikhail.
| Mezhiba, Andrey V.
| Köse, Selçuk
| Friedman, Eby G.
Material type:
E-bookPublisher: Cham : Springer International Publishing, 2016Edition: 4th ed.Description: 1 recurso en línea (XXXVII, 742 páginas) : 426 ilustraciones, 89 ilustraciones en color.ISBN: 9783319293950.Subject: Electrónica
| Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|---|
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | TK7888.4 V357 2016 EB (Browse shelf(Opens below)) | .i11591869 | Acceso electrónico | eBOOK .i11591869 |
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From the Contents: Introduction -- Inductive Properties of Electric Circuits -- Properties of On-Chip Inductive Current Loops -- Electromigration -- Scaling Trends of On-Chip Power Distribution Noise -- High Performance Power Distribution Systems -- On-Chip Power Distribution Networks -- Computer-Aided Design and Analysis -- Closed Form Expressions for Fast IR Drop Analysis.
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
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