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Heat Transfer and Pressure Drop in Flow Boiling in Microchannels / by Sujoy Kumar Saha, Gian Piero Celata

By: Saha, Sujoy Kumar
Contributor(s): SpringerLink (Online service) | Celata, Gian Piero
Material type: materialTypeLabelE-bookSeries: SpringerBriefs in Applied Sciences and TechnologyPublisher: Cham : Springer International Publishing, 2016Description: 1 recurso en línea (X, 55 p.) : 40 ilustraciones, 16 ilustraciones en color.ISBN: 9783319202853.Subject: Calor -- Transmisión | Ingeniería hidráulica | Termodinámica | Transferencia de masa | FluidosDDC classification: 621.4021 Online resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Contents:
1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.
Abstract: This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.
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Holdings
Item type Current library Collection Call number Copy number Status Date due Barcode Item holds
LIBRO-E NO PRÉSTAMO LIBRO-E NO PRÉSTAMO Madrid Digital Acceso Electrónico (UEM) Ciencias e Ingeniería QC320 .S24 2016 EB (Browse shelf(Opens below)) .i11584117 Acceso electrónico eBOOK .i11584117
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1. Introduction -- 2. Significance of flow visualization in micro channels -- 3. Pressure Drop Studies -- 4. Conclusion and further research.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling. A companion edition in the Springer Brief Subseries on Thermal Engineering and Applied Science to "Critical Heat Flux in Flow Boiling in Micro channels," by the same author team, this volume is idea for professionals, researchers and graduate students concerned with electronic cooling.

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