Progressive and Integrative Ideas and Applications of Engineering Systems Under the Framework of IOT and AI : Proceedings of 2nd International Conference on Intelligent Systems Design and Engineering Applications / edited by Yongsheng Ma
Series: (Lecture Notes in Electrical Engineering, 1876-1119 ;; 1076).Publisher: Singapore : Springer International Publishing, 2024Edition: first edition 2024.Description: 1 recurso en línea.ISBN: 9789819963034.Online resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias de la Salud | Q334-342 TA347.A78 2024 2024 (Browse shelf(Opens below)) | Acceso electrónico | eBook04012038 |
Forward -- Preface -- Conference -- Committees -- Part I Theory and Application of Artificial Intelligence Technologies in Industry -- Part II System Design and Data Analysis within the Context of Internet of Things (IOT) -- Part III System Automation, Control, and Robots -- Part IV Smart Product Design and Integrated Manufacturing -- Part V Sensors, Transducers and detection technology -- Index.
This volume of proceedings contains peer reviewed papers presented at 2023 International Conference on Intelligent Systems Design and Engineering Applications which was held in Okayama, Japan, May 12-14, 2023 (ISDEA2023). There are five major sessions covered in this book, including 1) Theory and Application of Artificial Intelligence Technologies in Industry; 2) System Design and Data Analysis within the Context of Internet of Things (IOT) ; 3) System Automation, Control, and Robots; 4) Smart Product Design and Integrated Manufacturing and 5) Sensors, Transducers and detection technology. This conference provides an idea-exchange and discussion platform for the world's engineers and academia to share cutting-edge information, address the hottest issue in intelligent systems design and engineering applications, explore new technologies, exchange and build upon ideas.
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