Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging / by Jong-Hoon Lee, Manos Tentzeris.
By: Lee, Jong-Hoon, autor
Contributor(s): Tentzeris, Manos M., autor
Material type: 
E-bookSeries: (Synthesis Lectures on Computational Electromagnetics, 1932-1716).Publisher: Cham : Springer International Publishing, 2008Edition: 1st edition 2008.Description: 1 recurso en línea (X, 108 páginas).ISBN: 9783031017032.Subject: Componentes electrónicos | Sistemas de comunicación inalámbricosOnline resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | TK7870.15 2008 EB (Browse shelf(Opens below)) | Acceso electrónico | eBook.01112149 |
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| TK7870 .D86 2005 EB Hertzian tales : electronic products, aesthetic experience, and critical design | TK7870 .L546 2017 EB Fundamentals of electronic systems design | TK7870 .N383 2015 EB Reliable Design of Electronic Equipment An Engineering Guide | TK7870.15 2008 EB Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging | TK7870.15 2019 EB Modeling and Application of Flexible Electronics Packaging | TK7870.15 R436 2017 EB RF and microwave microelectronics packaging II | TK7870.17 2018 EB Fan-Out Wafer-Level Packaging |
Introduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
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