Trends and Applications in Software Engineering Proceedings of the 8th International Conference on Software Process Improvement (CIMPS 2019) / edited by Jezreel Mejia, Mirna Muñoz, Álvaro Rocha, Jose A. Calvo-Manzano.
Contributor(s): SpringerLink (Online service)
| Mejia, Jezreel., editor | Muñoz, Mirna., editor | Rocha, Álvaro., editor | A. Calvo-Manzano, Jose., editor
Material type: 
E-bookSeries: (Advances in Intelligent Systems and Computing, 2194-5357; 1071); (Intelligent Technologies and Robotics (Springer-42732)).Publisher: Cham : Springer International Publishing : Imprint: Springer, 2020Edition: 1st ed. 2020.Description: 1 recurso en línea (XIII, 290 páginas) : 101 ilustraciones, 67 ilustraciones a color..ISBN: 9783030335472.Subject: Ingeniería del softwareOnline resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
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LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | QA76.758 2020 EB (Browse shelf(Opens below)) | Acceso electrónico | eBook04032120 |
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This book contains a selection of papers from The 2019 International Conference on Software Process Improvement (CIMPS'19), held between the 23th and 25th of October in León, Guanajuato, México. The CIMPS'19 is a global forum for researchers and practitioners that present and discuss the most recent innovations, trends, results, experiences and concerns in the several perspectives of Software Engineering with clear relationship but not limited to software processes, Security in Information and Communication Technology and Data Analysis Field. The main topics covered are: Organizational Models, Standards and Methodologies, Software Process Improvement, Knowledge Management, Software Systems, Applications and Tools, Information and Communication Technologies and Processes in non-software domains (Mining, automotive, aerospace, business, health care, manufacturing, etc.) with a demonstrated relationship to Software Engineering Challenges.
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