Transactions on Engineering Technologies : International MultiConference of Engineers and Computer Scientists 2018 / edited by Sio-Iong Ao, Haeng Kon Kim, Oscar Castillo, Alan Hoi-shou Chan, Hideki Katagiri
Contributor(s): SpringerLink (Online service)
| Ao, Sio-Iong, editor | Kim, Haeng Kon, editor | Castillo, Oscar, editor
| Chan, Alan Hoi-shou, editor | Katagiri, Hideki, editor
Material type:
E-bookSeries: (Technologies and Robotics (Springer-42732)).Publisher: Singapore : Springer Singapore, 2020Edition: First edition.Description: 1 recurso en línea (IX, 364 páginas) : 195 ilustraciones, 95 ilustraciones a color.ISBN: 9789813298088.Subject: Ingeniería -- Congresos y asambleas
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | TA5 2020 EB (Browse shelf(Opens below)) | Acceso electrónico | eBook10012086 |
Chapter 1. elected topics in engineering physics -- Chapter 2. Selected topics in communications systems -- Chapter 3. Selected topics in control theory -- Chapter 4. Selected topics in automation -- Chapter 5. Selected topics in engineering mathematics -- Chapter 6. Selected topics in scientific computing -- Chapter 7. Selected topics in electrical engineering -- Chapter 8. Selected topics in industrial applications.
This book contains revised and extended research articles written by prominent researchers, selected from presentations at the International MultiConference of Engineers and Computer Scientists (IMECS 2018) held in Hong Kong, 14-16 March, 2018. Topics covered include engineering physics, communications systems, control theory, automation, engineering mathematics, scientific computing, electrical engineering, and industrial applications. The book gives a snapshot of selected advances in engineering technologies and their applications, and will serve as a useful reference for researchers and graduate students in these fields.
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