Modeling and Application of Flexible Electronics Packaging / by YongAn Huang, Zhouping Yin, Xiaodong Wan
By: Huang, YongAn, autor
Contributor(s): Yin, Zhouping, autor | Wan, Xiaodong, autor | SpringerLink (Online service)
Series: (Engineering (Springer-11647)).Publisher: Singapore : Springer Singapore : Imprint: Springer, 2019Description: 1 recurso en línea (XVII, 287 páginas).ISBN: 9789811336270.Subject: ElectrónicaOnline resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | TK7870.15 2019 EB (Browse shelf(Opens below)) | Acceso electrónico | eBooks24062457 |
Browsing Madrid Digital shelves, Shelving location: Acceso Electrónico (UEM) Close shelf browser (Hides shelf browser)
| TK7870 .L546 2017 EB Fundamentals of electronic systems design | TK7870 .N383 2015 EB Reliable Design of Electronic Equipment An Engineering Guide | TK7870.15 2008 EB Three-Dimensional Integration and Modeling A Revolution in RF and Wireless Packaging | TK7870.15 2019 EB Modeling and Application of Flexible Electronics Packaging | TK7870.15 R436 2017 EB RF and microwave microelectronics packaging II | TK7870.17 2018 EB Fan-Out Wafer-Level Packaging | TK7870.17 Q745 2015 EB Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications |
Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
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