Semiconductor Advanced Packaging
Lau, John H.
Semiconductor Advanced Packaging by John H. Lau - First edition 2021 - 1 recurso en línea (XXII, 498 páginas) 557 ilustraciones, 530 ilustraciones a color - Engineering (SpringerNature-11647) Engineering (R0) (SpringerNature-43712) .
Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
9789811613760
10.1007/978-981-16-1376-0 doi
Semiconductores
TK7871.85 / 2021 EB
Semiconductor Advanced Packaging by John H. Lau - First edition 2021 - 1 recurso en línea (XXII, 498 páginas) 557 ilustraciones, 530 ilustraciones a color - Engineering (SpringerNature-11647) Engineering (R0) (SpringerNature-43712) .
Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
9789811613760
10.1007/978-981-16-1376-0 doi
Semiconductores
TK7871.85 / 2021 EB